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Primer on Radiation Oncology Physics Video Tutorials with Textbook and Problems

Primer on Radiation Oncology Physics Video Tutorials with Textbook and Problems

Gain mastery over the fundamentals of radiation oncology physics! This package gives you over 60 tutorial videos (each 15-20 minutes in length) with a companion text providing the most complete and effective introduction available. Dr. Ford has tested this approach in formal instruction for years with outstanding results. The text includes extensive problem sets for each chapter. The videos include embedded quizzes and whiteboard screen technology to facilitate comprehension. Together this provides a valuable learning tool both for training purposes and as a refresher for those in practice. Key Features A complete learning package for radiation oncology physics including a full series of video tutorials with an associated textbook companion website Clearly drawn simple illustrations throughout the videos and text Embedded quiz feature in the video tutorials for testing comprehension while viewing Each chapter includes problem sets (solutions available to educators) | Primer on Radiation Oncology Physics Video Tutorials with Textbook and Problems

GBP 82.99
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On Animation The Director's Perspective Vol 1

On Animation The Director's Perspective Vol 1

Be a fly on the wall as industry leaders Bill Kroyer and Tom Sito take us through insightful face-to-face interviews revealing in these two volumes the journeys of 23 world-class directors as they candidly share their experiences and personal views on the process of making feature animated films. The interviews were produced and edited by Ron Diamond. Your job is not to be the one with the answers. You should be the one that gets the answers. That’s your job. You need to make friends and get to know your crew. These folks are your talent your bag of tricks. And that’s where you’re going to find answers to the big problems - Andrew Stanton It’s hard. Yet the pain you go through to get what you need for your film enriches you and it enriches the film. – Brenda Chapman Frank and Ollie always used to say that great character animation contains movement that is generated by the character’s thought process. It can’t be plain movement. – John Lasseter The beauty of clay is that it doesn’t have to be too polished or too smooth and sophisticated. You don’t want it to be mechanical and lifeless. – Nick Park The good thing about animation is that tape is very cheap. Let the actor try things. This is where animation gets to play with spontaneity. You want to capture that line as it has never been said before. And most likely if you asked the actor to do it again he or she just can’t repeat that exact performance. But you got it. – Ron Clements | On Animation The Director's Perspective Vol 1

GBP 43.99
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Influence of Temperature on Microelectronics and System Reliability A Physics of Failure Approach

Influence of Temperature on Microelectronics and System Reliability A Physics of Failure Approach

This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds flip-chip or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature temperature cycle temperature gradient and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens including burn-in for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The | Influence of Temperature on Microelectronics and System Reliability A Physics of Failure Approach

GBP 59.99
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